LOCTITE® ECCOBOND UF 3812
功能与优点
Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.
If you're looking for a halogen-free underfill that shows stable performance under thermal stress, consider LOCTITE® ECCOBOND UF 3812. This black-liquid, epoxy-based underfill showcases excellent thermal cycle performance and sturdy electrical performance under thermal and humid bias. Our ECCOBOND UF 3812 solution can be used with most Pb-free solders; is designed for the production of CSPs, WLCSPs, and BGAs; and is formulated to flow at room temperature with no additional preheating required.
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技术信息
| 使用寿命 | 3.0 天 |
| 储存温度 | -20.0 °C |
| 储能模量, DMA @ 25.0 °C 3-point bending | 3004.0 N/mm² (435580.0 psi ) |
| 固化方式 | 热+紫外线 |
| 固化时间, @ 130.0 °C | 10.0 分钟 |
| 应用 | 封装, 未充满 |
| 热膨胀系数 (CTE), Above Tg | 175.0 ppm/°C |
| 热膨胀系数 (CTE), Below Tg | 48.0 ppm/°C |
| 玻璃化温度 (Tg) | 131.0 °C |
| 粘度, Physica @ 25.0 °C Spindle CP50-1, Shear Rate 1,000 s⁻¹ | 350.0 mPa.s (cP) |
| 适用时间 | 1.0 天 |
| 颜色 | 黑色 |
LOCTITE® ECCOBOND UF 3812
Reworkable epoxy underfill encapsulant for CSP, WLCSP, and BGA production. Compatible with most lead-free solders.