BERGQUIST® GAP PAD® TGP 6000ULM
Features and Benefits
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).
BERGQUIST® GAP PAD TGP 6000ULM is an extremely soft, thermal interface material with a higher natural tack, eliminating the need for additional adhesive layers and providing stick-in-place characteristics during assembly. The specially designed formulation offers excellent thermal performance at low pressures and is highly conforming, allowing for excellent wet-out at the interface.
- Thermal conductivity: 6 W/m-K (ASTM D5470)
- Excellent interfacing and wet-out characteristics
- Supplied with protective liners for ease of use
- UL94 V-0 compliant
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | Gray |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 1.524 - 3.175 mm |
BERGQUIST® GAP PAD® TGP 6000ULM
A high performance, thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 6.0 W/m-K and ultra low modulus (ULM).