BERGQUIST® SIL PAD TSP 1100ST
Features and Benefits
BERGQUIST SIL PAD TSP 1100ST is a silicone based elastomeric material ideal for placement between an electronic power device and heat sink.
BERGQUIST® SIL PAD TSP 1100ST is a silicone based, electrically insulating, thermally conductive, soft elastomeric material. This product is fiberglass reinforced which exhibits excellent thermal performance at low mounting pressures. It can be repositioned ensuring higher utilization, ease of use and assembly error reduction.
- Re-position able for higher utilization, ease of use and assembly error reduction
- Inherent tack on both sides for exceptional thermal performance and easy placement
- Exhibits exceptional thermal performance even at a low mounting pressure
- Lined on both sides for ease of handling prior to placement in high volume assemblies
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | Yellow |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 180.0 °C |
| Standard thickness | 0.305 mm |
| Thermal conductivity | 1.1 W/mK |
BERGQUIST® SIL PAD TSP 1100ST
BERGQUIST SIL PAD TSP 1100ST is a silicone based elastomeric material ideal for placement between an electronic power device and heat sink.