BERGQUIST® LIQUI FORM TLF 10000 - 1.0/case
Features and Benefits
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A 1-part, red, silicone-based, fully-cured thermal interface gel designed for high power industrial infrastructure electronics systems.
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements of datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards.
- Dispensable pre-cured: requires no mixing or refrigeration
- Excellent thermal cycling performance & dispense properties
- Thermal conductivity: 10 W/m-K, ASTM D5470
- Low thermal impedance at thin and thick gaps
- Low compression set to reduce stress on components
Documents and Downloads
Safety Data Sheets and RoHs
- 1.0/case - IDH 2746327
- 16.0/case - IDH 2746330
- Pail 1.0/case - IDH 2796659
BERGQUIST® LIQUI FORM TLF 10000 2746327 en-US
IDH:
2746327
Quantity: 1.0/case
BERGQUIST® LIQUI FORM TLF 10000 2746330 en-US
IDH:
2746330
Quantity: 16.0/case
BERGQUIST® LIQUI FORM TLF 10000, 1 gallon pail Pail 2796659 en-US
IDH:
2796659
Size Case: Pail
Quantity: 1.0/case
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Additional Documents
Technical Information
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Shelf life, @ 0.0 - 35.0 °C | 180.0 day |
| Thermal conductivity | 10.0 W/mK |
BERGQUIST® LIQUI FORM TLF 10000
A 1-part, red, silicone-based, fully-cured thermal interface gel designed for high power industrial infrastructure electronics systems.