BERGQUIST® LIQUI FORM TLF 10000 Specially designed for the Data & Telecom Market
Features and Benefits
A 1-part, red, silicone-based, fully-cured thermal interface gel designed for high power industrial infrastructure electronics systems.
BERGQUIST® LIQUI FORM TLF 10000 is a thermally conductive, dispensable, highly conformable gel thermal interface material designed to meet the demanding requirements of datacom, telecom, and industrial automation applications. Its unique formulation delivers a balanced mix of high thermal conductivity, dispensing efficiency, and high reliability. This material is designed to provide efficient heat transfer between high-power electronic components and heat sinks. Recognized for its importance in optimizing electronics performance, the high thermal conductivity gel has won several industry awards.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Additional Documents
Technical Information
Flame rating | V-0 |
Operating temperature | -60.0 - 200.0 °C |
Shelf life, @ 0.0 - 35.0 °C | 180.0 day |
Thermal conductivity | 10.0 W/mK |