BERGQUIST® GAP PAD TGP 1000VOUS
Features and Benefits
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
- Highly conformable, low hardness
- Thermal conductivity: 1.0 W/m-K
- High dielectric strength
- Decreased strain
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | Pink |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.508 - 6.35 mm |
| Thermal conductivity | 1.0 W/mK |
| Young's modulus, ASTM D575 | 55.0 KPa (8.0 psi ) |
BERGQUIST® GAP PAD TGP 1000VOUS
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.