BERGQUIST® GAP PAD® TGP 1000VOUS
Známé jako Gap Pad® VO Ultra Soft
Vlastnosti a výhody
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
Oblasti Použití
Dokumenty ke stažení
Hledáte TS nebo BL v jiném jazyce?
Další dokumenty
Technické informace
| Barva | Růžová |
| Provozní teplota | -60.0 - 200.0 °C |
| Standardní tloušťka | 0.508 - 6.35 mm |
| Tepelná vodivost | 1.0 W/mK |
| Typ přepravce | Skleněná vlákna |
| Youngův modul, ASTM D575 | 55.0 KPa (8.0 psi ) |
BERGQUIST® GAP PAD® TGP 1000VOUS
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.