BERGQUIST® GAP PAD® TGP 1000VOUS
Poznano kot Gap Pad® VO Ultra Soft
Lastnosti in prednosti
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.
BERGQUIST® GAP PAD TGP 1000VOUS is a pre-cured and electrically insulating material with a gel-like modulus that provides shock absorbing and low stress vibration-dampening characteristics. This product is recommended for applications that require isolation between heat sinks and high-voltage, bare-leaded devices. Ideal for filling air gaps in high voltage devices.
Preberite več
Dokumenti in prenosi
Ali iščete tehnični list ali varnostni list v drugem jeziku?
Dodatni dokumenti
Tehnične informacije
| Barva | Rožnata |
| Delovna temperatura | -60.0 - 200.0 °C |
| Standardna debelina | 0.508 - 6.35 mm |
| Toplotna prevodnost | 1.0 W/mK |
| Vrsta nosilca | Steklena vlakna |
| Youngovi moduli, ASTM D575 | 55.0 KPa (8.0 psi ) |
BERGQUIST® GAP PAD® TGP 1000VOUS
Thermally conductive, silicone-based gap pad filler with a thermal conductivity rating of 1.0 W/m-K and ultra conformable behavior.