LOCTITE® ABLESTIK ECF 568
Known as Ablestik ABLEFILM ECF568
Features and Benefits
LOCTITE ABLESTIK ECF 568, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 568 high purity adhesive is designed for substrate attach. This material is a low temperature cure version of ABLEFILM 550 adhesive.
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Documents and Downloads
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Technical Information
| Cure schedule, @ 95.0 °C | 2.0 hr. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 113.0 °C |
| Physical form | Film |
| Shear strength, Aluminium | 5100.0 psi |
LOCTITE® ABLESTIK ECF 568
LOCTITE ABLESTIK ECF 568, Epoxy Film, Assembly