LOCTITE® ABLESTIK 84-1LMI

Poznano kot ABLEBOND 84-1LMI

Lastnosti in prednosti

Die-attach electrically conductive adhesive specially designed for microelectronic chip bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.
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Tehnične informacije

Fizična oblika Pasta
Način strjevanja Strjevanje na podlagi toplote
Primeri uporabe Pritrjevalniki
Prostorninska upornost 0.0005 Ohm cm
Strižna trdnost, Aluminij 1500.0 psi
Temperatura skladiščenja -40.0 °C
Tiksotropni indeks 4.0
Urnik strjevanja, @ 150.0 °C 1.0 ure
Viskoznost, Brookfield CP51, @ 25.0 °C Speed 5 rpm 30000.0 mPa.s (cP)
Število komponent 1 Del