BERGQUIST® GAP FILLER TGF 2000
Poznat kao Gap Filler 2000
Elementi i pogodnosti
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.
BERGQUIST® GAP FILLER TGF 2000 is a two component, thermally conductive, silicone based liquid gap filler. It can be cured at room temperature and the curing process can be accelerated with heat. This product exhibits low modulus and good compression set. It also exhibits excellent low and high temperature mechanical and chemical stability and hence is fit for use over a wide range of temperatures.
Pročitajte više
Dokumenti i preuzimanja
Tražite tehničke listove ili bezbednosne listove na drugom jeziku?
Dodatna dokumenta
Tehnički podaci
| Dielektrična konstanta, @ 1kHz | 7.0 |
| Gustina | 2.9 g/cm³ |
| Odnos mešanja po težini | 1 : 1 |
| Odnos mešanja po zapremini | 1 : 1 |
| Otpornost na plamen | V-0 |
| Temperatura čuvanja | 25.0 °C |
| Toplotna provodljivost | 2.0 W/mK |
| Toplotni kapacitet, ASTM E1269 | 1.0 J/g-K |
| Tvrdoća po Šoru, Thirty second delay value, ASTM D2240 Shore 00 | 70.0 |
| Vek trajanja | 6.0 mesec |
| Zapreminska otpornost | 1×10 Ohm m |
| Učvršćivač | |
| Boja, Učvršćivač | Bela |
| Smola | |
| Boja, Smola | Ružičasta |
BERGQUIST® GAP FILLER TGF 2000
BERGQUIST GAP FILLER TGF 2000 is a silicone-based, thermally conductive and form-in-place gap filler ideal for fragile and low stress applications.