BERGQUIST® GAP FILLER TGF 1000SR
Features and Benefits
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This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.
BERGQUIST® GAP FILLER TGF 1000SR is a 2-part, silicone based, thermally conductive liquid gap-filling material that features superior slump resistance. The mixed system will cure at room temperature, or faster with the addition of heat. Once cured, it provides a soft, thermally conductive, form-in-place elastomer ideal for fragile assemblies and capable of filling unique and intricate air voids and gaps. It has excellent low- and high-temperature mechanical and chemical stability, and is intended for use in automotive electronics applications.
- Excellent slump resistance
- Excellent low- and high-temperature stability
- Ultra-conforming
- Excellent wet-out for low-stress interface applications
- Thermal conductivity: 1.0 W/m-K
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 175.0 °C |
| Thermal conductivity | 0.1 W/mK |
| Hardener | |
| Colour, Hardener | White |
BERGQUIST® GAP FILLER TGF 1000SR
This 2-part, silicone-based, thermally conductive, liquid gap-filling material has excellent slump resistance (stays in place). It’s ideal for use in automotive electronics applications.