Potting Compounds

Potting compounds are at the frontline of electronics assembly, delivering effective protection in challenging environmental conditions while improving mechanical strength and offering high electric insulation. Used within a variety of industries, electrical potting compounds are found within a broad range of consumer electronics, as well as used in applications across the automotive, aerospace, and other industries where electronic assemblies are prevalent.

Electronics potting materials are a permanent protective solution which will remain as an integral part of the unit to protect the electronic assembly while providing numerous benefits:    

• Electrical insulation 
• Enhanced mechanical strength 
• Heat dissipation
• Vibration/shock resistance
• Corrosion protection
• Chemical protection
• Environmental influences

Potting compounds help solve numerous problems within the manufacturing and assembly of electronics products. The main reasons for using potting compounds over other types of sealant are to protect against moisture to prevent short circuits, to offer increased chemical protection in complex assemblies, to provide mechanical shock and vibration resistance in challenging environmental conditions, and finally, to provide concealment of the intellectual property held within highly developed circuitry.

Henkel’s range of potting compounds is comprehensive and versatile enough to meet all of these challenges, as well as allowing manufacturers to develop new products to exacting specifications.

To learn more read on or contact one of our advisors. 

Potting Compound Product Types

Depending on your specific application, Henkel offers a range of electronics potting materials with various features and properties. Each type of potting compound is designed for use within a wide range of applications and the various potting materials ensure there is a suitable choice for whatever you need.

Comparison of Liquid Potting Materials

4 Major Constituents of Potting Material – 1 K and 2 K Potting

One - Component (1K) Potting: 1K potting compounds are a mixture of four constituents. The main constituents, Resin and Hardener, are already mixed together with no additional mixing required. 1K potting materials are therefore ready for use.  

The four constituents and their functions are as follows:

• Resin – A natural or synthetic compound that hardens with treatment. The compound is classified in a number of different ways, depending on its exact chemical composition and potential uses.
• Hardener – This substance (or mixture) is required for the polymerization reaction with the resin. During this chemical reaction, the hardener is consumed and becomes fully part of the polymer backbone. 
• Filler – Often inert, the filler is added to a resin/hardener mixture to establish desired properties such as thermoshock resistance, CTE density, dielectric properties etc.
• Additives – Multiple types of additives with various functions can be used depending on the objectives. An additive can be a (reactive) diluent, anti-foam agent, adhesion promoter, pigments, etc.
   

Two - Component (2K) Potting: Like 1K materials, 2K potting compounds also consist of four constituents, but the hardener (or its mixture) is physically separated from the resin. This separation prohibits reaction prior to mixing.  With 2K products, the constituents must be weighed and mixed and the polymerization reaction starts after mixing. In 2K potting materials, just as in 1K potting materials, various fillers and additives can be part of the formulation to achieve the required properties and performance of the cured material. 

Potting Selection Guide

Determine in a few steps Henkel's potting compounds for electronics and other applications and gain access to more technical details and downloads.

Ultimate Protection

Potting for electronic assemblies from Henkel deliver superb levels of performance in even the most challenging conditions. Ideal for use in potted/encapsulated led drivers and power supplies, alongside a broad range of other applications where reliable, robust, and flexible potting is required, our range of materials is suitable for any industry or application.

Potting and encapsulation systems from Henkel offer superb printed circuit boards and electrical device protection. Used in today’s most challenging environments such as automotive and aerospace where thermal conductivity and operating temperature boundaries are pushed to the limit, potting materials deliver enhanced mechanical strength, provide electrical insulation and improve thermal reliability.

Electronic Assembly

Electrical potting compounds are the ideal solution to electronic assembly, providing robust, flexible, mechanical protection for delicate components and cabling. The potting of electronic assemblies requires high-quality materials that are able to withstand demanding conditions. This ensures electronic assemblies can be used in applications where standard protection of components is insufficient.

Automotive Electronics

Electrical potting compounds are commonly used within the automotive industry, and with the rise of electric vehicles, they are increasingly important in both conventional automotive electronics and as part of ADAS systems. In particular, polyacrylate electronics potting materials deliver the ideal set of characteristics for use in sensors and other components regularly exposed to oil and grease. Additionally, they are commonly found within power conversion systems, providing flexibility and thermal resistance in challenging environmental conditions.

Further Areas of Use with Sonderhoff Potting Materials

Further Resources

For more information on Henkel’s potting compounds, download PDF resources here. Alternatively, for more TDS and SDS sheets contact us today.