LOCTITE® ABLESTIK 2000
Known as ABLEBOND 2000 (3.6G)
Features and Benefits
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive
LOCTITE® ABLESTIK 2000 electrically conductive die attach adhesive is designed for Pb-free PBGA and Array BGA packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
- Proprietary hybrid chemistry
- Pb-free applications
- Ultra-low moisture absorption
- High hot/wet adhesion
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 1.0 ppm |
| Extractable ionic content, Potassium (K+) | 1.0 ppm |
| Extractable ionic content, Sodium (Na+) | 1.0 ppm |
| Hot die shear strength | 8.0 kg-f |
| RT die shear strength | 16.0 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 193.0 N/mm² (28000.0 psi ) |
LOCTITE® ABLESTIK 2000
LOCTITE ABLESTIK 2000, Proprietary Hybrid Chemistry, Electrically Conductive Die Attach Adhesive