LOCTITE® ECCOBOND DP 1006

Features and Benefits

LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive
LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications.
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Technical Information

Applications Die attach, Encapsulating
Coefficient of thermal expansion (CTE), Above Tg 220.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 50.0 ppm/°C
Colour Light yellow
Cure schedule, Recommended @ 140.0 °C 2.0 sec.
Cure type Heat cure
Glass transition temperature (Tg) 27.0 °C
Storage temperature -20.0 °C
Viscosity, Brookfield, @ 25.0 °C Speed 5 rpm 65000.0 mPa·s (cP)