LOCTITE® ECCOBOND DP 1006
Features and Benefits
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive
LOCTITE® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications.
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Technical Information
| Applications | Die attach, Encapsulating |
| Coefficient of thermal expansion (CTE), Above Tg | 220.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Below Tg | 50.0 ppm/°C |
| Colour | Light yellow |
| Cure schedule, Recommended @ 140.0 °C | 2.0 sec. |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 27.0 °C |
| Storage temperature | -20.0 °C |
| Viscosity, Brookfield, @ 25.0 °C Speed 5 rpm | 65000.0 mPa·s (cP) |
LOCTITE® ECCOBOND DP 1006
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive