LOCTITE ABLESTIK ECF 563

fitur dan keuntungan

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LOCTITE ABLESTIK ECF 563, Epoxy Film, Assembly
LOCTITE® ABLESTIK ECF 563 epoxy adhesive film is ideal for bonding "hot" devices onto heat sinks in applications where electrical insulation is not required. This adhesive provides RF/EMI shielding in bonding microwave substrates into packages.
  • Electrically conductive
  • Thermally conductive
  • Low squeeze-out during bonding
  • Thin, uniform bondline control
  • Electrically conductive in the x, y, and Z axis
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LOCTITE ABLESTIK ECF 563
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Informasi Teknis

Formulir Fisik Film
Jadwal Pengerasan, @ 150.0 °C 30.0 min.
Kekuatan Geser, Aluminum 2500.0 psi
Ketebalan Lem Lembaran Karier 25.0 µm
Konduktivitas Termal 1.0 W/mK
Suhu Transisi Kaca (Tg) 88.0 °C
Teknologi Epoxy
Tipe Pengeringan Heat Cure