Package-Level EMI

The convergence of advanced RF communication capability, miniaturization and package-level integration underscore the requirement for novel approaches to EMI shielding.  While this has traditionally been managed at the board level, that alone will no longer address the challenges of integrated packages, such as SiPs. Henkel’s suite of specialized materials designed specifically for package-level use, provide reliable shielding and strong adhesion performance within demanding electronic environments. Compartment and conformal shielding materials offer two solutions, which can be used independently of one another or together as a comprehensive EMI system. Compartmental shielding materials provide adaptable designs for internal component-to-component shielding with in-package partitioning, while conformal shielding materials provide for external package-to-package shielding with an ultra-thin, conductive outer coating layer. 

Package-level EMI Compartmental Shielding benefits

With multiple ICs and MEMS sensors integrated into a single module, in-package effective RF protection between the various baseband, RF, analog, and power management components is required to protect performance. Compartment shielding is a package-level solution that allows a shielding partition to be created using laser-ablation on the package mold to isolate chips within the package. This is followed by jet dispensing of highly conductive material into the trench. If desired, trench filling can be followed by conformal spray coating of the entire package. Henkel’s compartmental shielding solutions offer:

• High filling quality of high depth-width aspect ratio trench
• Advanced, custom partition designs for miniaturized devices
• High shielding effectiveness and high reliability
• Flexible trench-filling material formulations for specific requirements: different frequency shielding, process-specific properties and application-specific properties
• Proven process with excellent performance

Package-level Conformal Spray EMI Coating

Conformal coating metal inks are applied via spray coating equipment, enabling a high-UPH process that results in a ultra-thin package coating to protect against electromagnetic interference. There are many benefits associated with EMI shielding coating which include:

• Process adaptability and simplicity
• Low cost implementation, low maintenance solution
• High shielding effectiveness and reliability
• Miniaturization-friendly ultra-thin layer
• Flexible conductive formulations for various requirements; different frequency shielding, color variations, process-specific properties and application-specific properties
• Proven process with successful in-application performance

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