BERGQUIST® GAP FILLER TGF 3600
Known as Gap Filler 3500S35
Features and Benefits
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This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve coefficient of thermal expansion (CTE) stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with the application of heat.
- Thermal conductivity: 3.6 W/m-K
- Ultra low modulus
- Ultra-conforming
- Easily dispensable
- UL94 V-0 compliant
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
Documents and Downloads
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Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 3.6 W/mK |
| Mixed | |
| Color, Mixed | Blue |
| Resin | |
| Color, Resin | White |
| Hardener | |
| Color, Hardener | Blue |
BERGQUIST® GAP FILLER TGF 3600
This highly thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It has excellent low- and high-temperature, mechanical and chemical stability.