BERGQUIST® GAP FILLER TGF 3600
Known as Gap Filler 3500S35
Features and Benefits
A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.
BERGQUIST® GAP FILLER TGF 3600 is a 3.6 W/m-K thermally conductive, ultra conforming, silicone-based liquid gap filler (2-part). It exhibits ultra-high thermal performance and superior softness. This product has low modulus to help relieve CTE stresses in thermal cycling and provide excellent vertical gap stability. It can be used for fragile and low stress applications in various fields. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- Thermal conductivity: 3.6 W/m-K
- Ultra low modulus
- Ultra conforming
- Easily dispensable
- UL94 V-0 compliance
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 3.6 W/mK |
| Mixed | |
| Color, Mixed | Blue |
| Resin | |
| Color, Resin | White |
| Hardener | |
| Color, Hardener | Blue |
BERGQUIST® GAP FILLER TGF 3600
A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.