LOCTITE® ABLESTIK 563K
Tuntud kui Ablestik ABLEFILM 563K
Omadused ja eelised
LOCTITE ABLESTIK 563K, Epoxy Film, Assembly
LOCTITE® ABLESTIK 563K adhesive film is suitable for bonding "hot" devices onto heat sinks where electrical insulation and good heat transfer are required. It exhibits low squeeze out during bonding. This product provides high strength over a wider temperature range than is normally associated with flexible films.
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Tehniline teave
| Füüsiline vorm | Kile |
| Klaasistumistemperatuur (Tg) | 97.0 °C |
| Kõvenemisaeg, @ 150.0 °C | 30.0 minut |
| Nihkejõud, Alumiinium | 3000.0 psi |
| Soojusjuhtivus | 1.1 W/mK |
| Tahkumistüüp | Kuumkõvenemine |
LOCTITE® ABLESTIK 563K
LOCTITE ABLESTIK 563K, Epoxy Film, Assembly