BERGQUIST® LIQUI FORM TLF 6000

BERGQUIST® LIQUI FORM TLF 6000 thermally conductive gel interface material is designed to meet the demanding requirements in certain telecom market applications. Its unique formulation assures a balanced mix of high thermal conductivity, good dispensing efficiency and high thermal reliability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable vertical gap stability is required. BERGQUIST LIQUI FORM TLF 6000 is pre-cured, requiring no mixing or refrigeration.