LOCTITE® EA D609

功能与优点

LOCTITE EA D609, epoxy, low termperature bonding
LOCTITE® EA D609 is an exceptional epoxy formulation recommended for lower temperature or wet industrial bonding applications where fast curing is required. This ultra clear, two part, low viscosity system mixes easily at room temperature. It is suitable for high performance structural bonding applications requiring a combination of very fast room temperature cure, low shrinkage, and excellent mechanical properties. Fully cured LOCTITE® EA D609 is an excellent electrical insulator and provides superior resistance to vapors and gases, water, galvanic action, petroleum fuels, salt solution and many other organic and inorganic compounds.
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技术信息

储存温度 8.0 - 21.0 °C
剪切强度, 铝(蚀刻) 1800.0 psi
固化方式 室温固化
固化时间, @ 77.0 °C 24.0 小时
推荐与以下物料搭配使用 金属
组分数量 双组份
混合的
使用寿命, 混合的 @ 25.0 °C 20 g mass 5.0 分钟
硬化剂
粘度, 硬化剂 11000.0 - 19000.0 mPa.s (cP)
树脂
粘度, 树脂 11000.0 - 19000.0 mPa.s (cP)