LOCTITE® ABLESTIK 2600BT
功能与优点
LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach
LOCTITE® ABLESTIK 2600BT adhesive is designed for thermal management applications requiring high heat extraction from the die. This adhesive uses a unique suspension system containing silver and resin particles suspended in solvent carrier. Once the material is fully cured and the solvent is evaporated, the adhesive has an extremely high silver loading. LOCTITE ABLESTIK 2600BT adhesive provides very low thermal resistance between chip to case, nearing solder and eutectic-type materials.
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技术信息
| RT 模剪切强度 | 10.0 kg-f |
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 5.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 热模剪切强度 | 1.4 kg-f |
| 热膨胀系数 (CTE) | 40.0 ppm/°C |
LOCTITE® ABLESTIK 2600BT
LOCTITE ABLESTIK 2600BT, Thermal Management, Die Attach