LOCTITE® ABLESTIK ABP 2030SCR
Features and Benefits
LOCTITE ABLESTIK ABP 2030SCR, Proprietary Hybrid Chemistry, Die Attach, Conductive Adhesive
LOCTITE® ABLESTIK ABP 2030SCR conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
- Low stress
- Low moisture uptake
- Solvent-free
- Low halogen content
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Cure type | Heat cure |
| Thermal conductivity | 2.0 W/mK |
| Thixotropic index | 5.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 15000.0 mPa·s (cP) |
LOCTITE® ABLESTIK ABP 2030SCR
LOCTITE ABLESTIK ABP 2030SCR, Proprietary Hybrid Chemistry, Die Attach, Conductive Adhesive