LOCTITE® ABLESTIK ABP 2030SCR
Características y Ventajas
LOCTITE ABLESTIK ABP 2030SCR, Proprietary Hybrid Chemistry, Die Attach, Conductive Adhesive
LOCTITE® ABLESTIK ABP 2030SCR conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
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Información técnica
Aplicaciones | Unión |
Conductividad térmica | 2.0 W/mK |
Tipo de curado | Curado Térmico |
Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 15000.0 mPa.s (cP) |
Índice tixotrópico | 5.0 |