LOCTITE® ABLESTIK 8900NC
Known as ABLEBOND 8900NC (6.5G)
Features and Benefits
LOCTITE ABLESTIK 8900NC, Epoxy, Die Attach
LOCTITE® ABLESTIK 8900NC die attach adhesive has been formulated for use in high throughput die attach applications. Actual performance will depend on die size, aspect ratio and package design.
- Snap curable
- Fast cure
- High strength
- Non-conductive
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 65.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 162.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 20.0 ppm |
| Extractable ionic content, Potassium (K+) | 10.0 ppm |
| Extractable ionic content, Sodium (Na+) | 10.0 ppm |
| Glass transition temperature (Tg) | 19.0 °C |
| RT die shear strength | 13.0 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 62.0 N/mm² (9000.0 psi ) |
| Thermal conductivity | 0.3 W/mK |
| Thixotropic index | 5.9 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 10000.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8900NC
LOCTITE ABLESTIK 8900NC, Epoxy, Die Attach