BERGQUIST® GAP PAD TGP 2200SF
Features and Benefits
BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.
BERGQUIST® GAP PAD TGP 2200SF is a thermally conductive and electrically isolating thermal interface material that is ideal for applications with uneven topologies and high stackup tolerances. Reinforced with fiberglass for easy handling and durability, this product is offered with a protective liner and reduced tack on one side for burn-in processes and easy rework.
- Thermally conductive 2.0 W/m-K
- Silicone-free formulation
- Medium compliance with easy handling
- Electrically isolating
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Technical Information
| Color | Green |
| Operating temperature | -60.0 - 125.0 °C |
| Shelf life | 12.0 mon. |
| Standard thickness | 0.254 - 3.175 mm |
| Storage temperature | 25.0 °C |
| Thermal conductivity | 2.0 W/mK |
| Resin | |
| Carrier type, Resin | Fiberglass |
BERGQUIST® GAP PAD TGP 2200SF
BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.