BERGQUIST® GAP PAD TGP 2200SF

Features and Benefits

BERGQUIST GAP PAD TGP 2200SF is a green, silicone-free, gap pad filling material with good thermal conductivity and designed for silicone-sensitive applications.
BERGQUIST® GAP PAD TGP 2200SF is a thermally conductive and electrically isolating thermal interface material that is ideal for applications with uneven topologies and high stackup tolerances. Reinforced with fiberglass for easy handling and durability, this product is offered with a protective liner and reduced tack on one side for burn-in processes and easy rework.
  • Thermally conductive 2.0 W/m-K
  • Silicone-free formulation
  • Medium compliance with easy handling
  • Electrically isolating
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Technical Information

Color Green
Operating temperature -60.0 - 125.0 °C
Shelf life 12.0 mon.
Standard thickness 0.254 - 3.175 mm
Storage temperature 25.0 °C
Thermal conductivity 2.0 W/mK
Resin
Carrier type, Resin Fiberglass