BERGQUIST® GAP PAD® TGP 2200SF
Features and Benefits
A green, silicone-free gap-filling polymer for silicone-sensitive applications.
BERGQUIST® GAP PAD TGP 2200SF is a thermally conductive, electrically isolating polymer, ideal for silicone-sensitive applications with uneven topologies and high stack-up tolerances, typically digital disk drives and fiber optics modules. BERGQUIST GAP PAD TGP 2200SF is reinforced with fiberglass for easy material handling and added durability during assembly. It has reduced tack on one side, allowing for burn-in processes and easy rework.
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Technical Information
Color | Green |
Operating temperature | -60.0 - 125.0 °C |
Shelf life | 12.0 mon. |
Standard thickness | 0.254 - 3.175 mm |
Storage temperature | 25.0 °C |
Thermal conductivity | 2.0 W/mK |
Resin | |
Carrier type, Resin | Fiberglass |