BERGQUIST® GAP FILLER TGF 4000
Features and Benefits
A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.
BERGQUIST® GAP FILLER TGF 4000 is a 4.0 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). The mixed liquid system cures at room temperature or can be accelerated using heat. It offers extended working time for improved manufacturing flexibility, and the low-level natural tack characteristics are ideal for assemblies where strong structural bonds are not required. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- Thermal conductivity: 4 W/m-K
- Ultra-conforming with excellent wet-out
- 100% solids - no cure by-products
- Extended working time for manufacturing flexibility
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 4.0 W/mK |
| Mixed | |
| Color, Mixed | Blue |
| Resin | |
| Color, Resin | Blue |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 4000
A highly thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Excellent low and high temperature, mechanical and chemical stability.