BERGQUIST® GAP FILLER TGF 1500
Features and Benefits
A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 1500 is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It features superior slump resistance and high shear thinning characteristics, resulting in optimum consistency and control during dispense. It also exhibits excellent low- and high-temperature mechanical and chemical stability. It is therefore ideal for use between any heat source and sink. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- Thermal conductivity: 1.8 W/m-K
- Optimized shear thinning characteristics for ease of dispensing
- Excellent slump resistance (stays in place)
- Ultra-conforming with excellent wet-out for low stress interface applications
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 1.8 W/mK |
| Mixed | |
| Color, Mixed | Yellow |
| Resin | |
| Color, Resin | Yellow |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 1500
A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.