BERGQUIST® GAP FILLER TGF 1500
Features and Benefits
A thermally-conductive liquid gap filler for easy, precision dispensing, low stress assembly, and low volatile outgassing for silicone sensitive applications.
BERGQUIST GAP FILLER TGF 1500 is a 2-part, high performance, thermally conductive liquid gap filler featuring superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. The mixed system will cure at room temperature, or faster with the addition of heat. Unlike cured thermal pad materials, a liquid offers infinite thickness variations with little or no stress to the sensitive components during assembly. You can also expect low level natural tack. Once cured, this product provides a soft, thermally conductive, form-in place elastomer ideal for fragile assemblies and filling unique and intricate air voids and gaps.
- Thermal conductivity: 1.8 W/m-K
- Optimized shear thinning characteristics for easy dispensing
- Excellent slump resistance (stays in place)
- Excellent wet-out for low stress interface applications
- Excellent low and high temperature stability
Documents and Downloads
Looking for a TDS or SDS in another language?
Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Operating temperature | -60.0 - 200.0 °C |
| Thermal conductivity | 1.8 W/mK |
| Mixed | |
| Color, Mixed | Yellow |
| Resin | |
| Color, Resin | Yellow |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 1500
A thermally-conductive liquid gap filler for easy, precision dispensing, low stress assembly, and low volatile outgassing for silicone sensitive applications.