BERGQUIST® HI FLOW THF 3000UT
Відомий як Hi-Flow® 565UT
Особливості та переваги
This naturally tacky, unreinforced, thermally conductive phase change material is designed for electronic power devices, such as a processor lid or die to a heat sink. No spill, no mess, high reliability.
BERGQUIST® HI FLOW THF 3000UT is a thermally conductive, 52°C (125.6°F) phase change material that comes in a tabulated pad form for ease of assembly. This product is designed with a phase change softening feature for improved handling prior to assembly. Very low thermal impedance is produced by wetting out the thermal interfaces at application temperatures and pressures. It is comparable to the best thermal greases and the consistent thickness ensures reliable performance without the pump-out often experienced with some thermal greases. Can be applied using low pressure roller or manual applications.
Дізнайтеся більше
Документи та завантаження
Шукаєте технічний паспорт (TDS) або паспорт безпеки матеріалу (MSDS) іншою мовою?
Технічна інформація
| Колір | Синій |
| Стандартна товщина | 0.127 - 0.254 мм |
| Стійкість до полум’я | V-0 |
| Температура застосування | 125.0 °C |
| Теплопровідність | 3.0 W/mK |
BERGQUIST® HI FLOW THF 3000UT
This naturally tacky, unreinforced, thermally conductive phase change material is designed for electronic power devices, such as a processor lid or die to a heat sink. No spill, no mess, high reliability.