BERGQUIST® HI FLOW THF 3000UT
Features and Benefits
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This naturally tacky, unreinforced, thermally conductive phase change material is designed for electronic power devices, such as a processor lid or die to a heat sink. No spill, no mess, high reliability.
BERGQUIST® HI FLOW THF 3000UT is a thermally conductive, 52°C (125.6°F) phase change material that comes in a tabulated pad form for ease of assembly. This product is designed with a phase change softening feature for improved handling prior to assembly. Very low thermal impedance is produced by wetting out the thermal interfaces at application temperatures and pressures. It is comparable to the best thermal greases and the consistent thickness ensures reliable performance without the pump-out often experienced with some thermal greases. Can be applied using low pressure roller or manual applications.
- Thermal conductivity: 3.0 W/m-K
- Naturally tacky and tabulated for ease of assembly
- Phase change softening temp 52°C (125°F)
- Thermal impedance: 0.05°C (32°F) -in2/W at 25 psi
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
Documents and Downloads
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Technical Information
| Color | Blue |
| Flame rating | V-0 |
| Operating temperature | 125.0 °C |
| Standard thickness | 0.127 - 0.254 mm |
| Thermal conductivity | 3.0 W/mK |
BERGQUIST® HI FLOW THF 3000UT
This naturally tacky, unreinforced, thermally conductive phase change material is designed for electronic power devices, such as a processor lid or die to a heat sink. No spill, no mess, high reliability.