TECHNOMELT® PA 668 WHITE
功能與優點
A 1-part, white, polyamide hot melt adhesive for molding applications.
TECHNOMELT® PA 668 WHITE is a white, polyamide-based hot melt adhesive for molding applications. Its creep resistance temperature stands at 130°C (266°F), and it resists temperature to a softening point of 150°C to 162°C (302°F to 323°F). TECHNOMELT PA 668 WHITE has an application temperature range of 180°C to 230°C (356°F to 446°F) and cures by physical setting into a thermoplastic condition of the bond area.
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技術資訊
| 延伸率，斷開處 | 600.0 % |
| 應用 | 封裝 |
| 熔體粘度，RVT, ASTM D 3236 @ 210.0 °C Spindle 27 | 3000.0 - 4200.0 mPa.s (cP) |
| 肖氏硬度, ISO 868/15s Shore A | 90.0 |
| 軟化點溫度 | 155.0 °C |
| 零組件數 | 1 組分 |
| 顏色 | 白色 |
TECHNOMELT® PA 668 WHITE
A 1-part, white, polyamide hot melt adhesive for molding applications.