Phase Change Materials

Features

Hi Flow provides similar handling to Bergquist Sil Pad materials at room temperature, but flows like grease at its designed phase change temperature. The following is an overview of the important features of the Hi Flow thermal grease alternative:

• Comparable thermal performance to grease in most applications
• Thermally conductive phase change compound
• Aluminum, film or fiberglass carriers and non-reinforced versions
• Low volatility substitute for thermal grease
• Easy to handle and apply in the manufacturing environment
• Tackified or tack-free at room temperature

Benefits

Using Bergquist Hi Flow or Loctite dispensable/printable phase change materials instead of grease can save time and money without sacrificing thermal performance. There are numerous benefits, including:

• No mess; thixotropic characteristics of the materials keep it from flowing out of the interface
• Easier handling;  tackified or tack-free at room temperature
• No protective liner required (Hi Flow)
• High thermal performance helps ensure CPU reliability
• Does not attract contaminants
• Easier material handling, shipping and processing
• Simplified application that can be easily automated

Options

The broad Hi Flow and Loctite product phase change portfolios offer a variety of choices to meet performance, handling and process needs, including:

• Availability with or without adhesive
• Dispensable/printable for high throughput processing
• Dispensable/printable phase change materials are dry to the touch and can be pre-applied on certain devices such as power components
• Aluminum carrier for applications not requiring electrical isolation
• Film or fiberglass carrier for electrical isolation
• Dry, non-reinforced material
• Tackified or tack-free at room temperature
• Tabbed parts, die-cut parts, sheets or bulk rolls
• Adhesive specifically for cold application without preheating heat sink
• Customized options are available; tooling charges vary depending on the complexity of the part

Applications

Hi Flow and Loctite thermal grease alternative materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications applications such as:

• UPS and SMPS AC/DC, DC/ DC or linear power supplies
• Between a CPU and heatsink
• Power conversion devices
• Fractional and integral motor control
• Leaded, surface mount and power module assemblies