Thermal GAP PAD^® Gap Fillers

Enhanced thermal conductivity through highly conformable gap filling capability

Bergquist GAP PAD^® brand gap fillers provide effective thermal interfaces between heat sinks and electronic devices, accommodating for uneven surfaces, air gaps and rough surface textures. The thermally conductive pad's soft construction offers high conformability to reduce interface resistance. In addition to effective heat dissipation, thermal GAP PAD^® gap fillers also help reduce vibration stress for shock dampening.

Exceptionally simple to use, Bergquist GAP PAD^® materials are manufactured to size and facilitate easy application: operators simply peel the protective film and place the thermal management pad on the desired component.

GAP PAD^® gap fillers are produced in a variety of standard dimensions and thicknesses, but can also be customized for specific application requirements. Available as custom die cut parts with the ability to individualize thickness and constructions, thermal GAP PAD^® materials are always fit for purpose to ensure optimized thermal control no matter what the application.

GAP PAD^® Materials

Photo of blue thermal interface material on top of components on a green pcb

With shock dampening abilities, thermal GAP PAD^® gap fillers are recommended for applications that require a minimum amount of pressure between components. For applications that do not allow silicone, such as silicone-sensitive optic components and automotive lighting, thermal GAP PAD^® materials are available in a silicone-free formulation.

The broad GAP PAD^® family provides an effective thermal interface between heat sinks and electronic devices where textures are present, and the GAP PAD^® thermal conductivity range is extensive — going as high as 12.0 W/mK. Henkel application specialists work closely with customers to specify the proper GAP PAD^® material for each unique thermal management pad requirement.

Features

Each of the many products within the GAP PAD^® portfolio is unique in construction, properties and performance. Thermal gap filler include the following features:

Low-modulus Polymer material
Available with fiberglass/rubber carriers or in a non-reinforced version
Innovative filler technology to achieve specific thermal and conformability characteristics
Highly conformable to uneven and rough surfaces with very low-stress thermal gap filler compression
Electrically isolating
Natural tack on one or both sides with protective liners
Variety of thicknesses and hardnesses
Range of thermal conductivities
Available in sheets and die-cut part

Benefits

Caption language

GAP PAD^® brand thermal products are designed to improve an assembly’s thermal performance and reliability.

Eliminate air gaps to reduce thermal resistance
Ultra-conformable with minimal thermal gap filler compression, low modulus reduces interfacial resistance
Low-stress vibration dampening
Shock absorbing
Easy material handling
Simplified application
Puncture, shear and tear resistance
Improved performance for high-heat assemblies

Options

Some GAP PAD^® products have special features for particular applications, including:

Available with or without adhesive
Rubber-coated fiberglass reinforcement
Thicknesses from 0.010 in. to 0.250 in.
Available in custom die-cut parts, sheets and rolls (converted or unconverted)
Custom thicknesses and constructions
Adhesive or natural inherent tack
Silicone-free thermal GAP PAD^® products available in thicknesses of 0.010 in.-0.125 in.
Custom, specialized GAP PAD^® gap fillers are available; tooling charges vary depending on tolerance and complexity of the part

Applications

GAP PAD^® thermal interface products are well-suited to a wide variety of electronics, automotive, medical, aerospace and satellite applications such as:

Between an IC and a heat sink or chassis; typical packages include BGAs, QFPs, SMT power components and magnetics
Between a semiconductor and heat sink
Memory modules; heat pipe assemblies
DDR SDRAM
Hard drive cooling
Power supplies
IGBT modules
Signal amplifiers

GAP PAD^® Applications and Industries

Henkel’s GAP PAD^® brand gap fillers can be used for both industrial and consumer applications in the following industries

Resources for GAP PAD^® Materials

Brochure: Thermal Management Materials

Download Document

Selection Guide: Thermal Interface Materials

Download Document

News & Insights

2020-04-01

Henkel Expands Line of High Thermal Conductivity BERGQUIST GAP PAD® materials for High Power Applications

Irvine, California – Henkel today announced the expansion of its award-winning thermal interface materials (TIMs) portfolio with the addition of a product developed to address the high-power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. BERGQUIST GAP PAD® TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today.

“Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm,” explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. “Highend routers, servers, switches and base band units continue...

Read More

Contact us

Please fill out the form below and we’ll respond shortly.

There are some errors, please correct them below.

What would you like to request?

Quote

TDS

SDS

Other

This field is required

Request details

This field is required

First Name

This field is required

Last Name

This field is required

Company (Optional)

This field is required

This field is invalid

Phone (Optional)

Leave empty if you are not a bot.:

Thermal GAP PAD^® Gap Fillers