Wirebond Laminate Packages

A broad selection of electrically non-conductive and conductive LOCTITE ABLESTIK die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to SmartCards – has different requirements, which is why Henkel has developed a suite of products that cater to the unique needs of laminate-based devices. Henkel die attach pastes offer a low modulus for stress reduction and warpage elimination, as well as bismaleimide (BMI) formulations for low moisture absorption to avoid package cracking during high temperature processing.

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Henkel is the established leader in die attach film technology for laminate-based devices. Electrically non-conductive die attach films provide stability and support for thinner wafer handling and facilitate thin bond lines within multi-die stacks for greater functionality. Compatibility with both copper and gold wire and various wafer grinding methods lend process versatility to these high performance products. Our long-standing formulation expertise led to the development of the market’s first viable electrically conductive die attach film, which is an ideal solution for Logic ICs, MOSFETs and RF devices, where low stress, high adhesion, tight die-to-pad clearance and high reliability are required.

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Wafer Backside Coating is a unique process that facilitates automated application of die attach adhesive at the wafer-level, followed by B-staging to form a die attach film. Adaptable to spray coating techniques, Henkel’s Wafer Backside Coatings enable process speed, thickness control and material uniformity. After thermal or UV B-staging and wafer dicing, die attach is achieved via heat and pressure to produce a consistent bond line and small, controlled fillets. Wafer Backside Coating adhesives are ideal for die attach applications where fillet control is critical.

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As board-on-chip (BOC) – also known as substrate-on- chip – packaging emerges as the dominant chip-scale packaging configuration for DRAM devices, die attach materials must deliver with precise control of bond line thickness and die tilt, minimal fillet formation and no contamination of wire bond pads. Henkel’s B-stage printable adhesives offer a more cost-effective solution than conventional adhesive films, providing the robust performance of film at a paste price point. The portfolio of LOCTITE ABLESTIK materials for BOC applications offers high UPH, printable formulations with low flow, controlled bond lines, minimized tolerance and bleed, as well as long storage and work lives.

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Protection from the effects of mechanical damage and corrosion is essential for the long-term reliability of semiconductor devices. With a range of products to tackle growing application demands, Henkel’s advanced encapsulant materials in both dam/fill and glob top systems meet the most stringent JEDEC-level testing, offering outstanding performance in formulations that simplify processing through robust dispensing characteristics and flexible cure mechanisms.

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Proper solder alloy formulation is vital for laminate-based packages, as the melting point must be tightly controlled to maintain the integrity of the organic substrate. Award-winning halogen-free, lead-free solder paste materials offer low-voiding performance and can be processed at lower reflow temperatures to align with the requirements of wirebond laminate package processing.

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