LOCTITE® ABLESTIK CDF 200
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LOCTITE ABLESTIK CDF 200, Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.
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Tehnične informacije
| Debelina lepilne folije | 15.0 µm |
| Natezni modul, @ 25.0 °C | 5400.0 N/mm² (783200.0 psi ) |
| Premer kockaste folije | 8.0 |
| Premer rezin | 8.0 |
| Strižna trdnost vročega vtiskovanja | 5.2 kg-f |
LOCTITE® ABLESTIK CDF 200
LOCTITE ABLESTIK CDF 200, Hybrid Chemistry, Die Attach