Thermal-Clad/Isolated Metal Substrate Thermal Management System Effective thermal management is key to ensuring consistent performance and long-term reliability of many electronic devices. Consumer demand for smaller, higher functioning devices presents even greater challenges for thermal management, as these conditions produce higher temperatures and more stress for electronic components. To ensure effective heat management for semiconductor devices, Henkel has developed the Thermal-Clad/Insulated Metal Substrate, which offers a highly-efficient method to cool these devices. Thermal-Clad insulated substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed circuit boards. This information will be presented during the upcoming Henkel webinar, along with details about selection of the application-specific dielectric. Henkel will explore in this webinar what alternate solution engineers can chose and which dielectric selection is the best for the application. Author: Michael Stoll... Read More
Electrically Conductive Adhesives for Building Reliable Connections Automotive electronics' technology continues to find new applications all around the vehicle. Electronic control units are often assembled using Electrically Conductive Adhesives (ECAs), where components are attached to noble metallized ceramic or HDI boards. The major limitation of ECAs has been their instability on common electronic metals, such as tin, which requires the use of expensive noble finished metallizations. Henkel however, has developed a product that enables stable performance with 100 percent tin-terminated components under several challenging test conditions. Henkel's ECAs provide the benefit of lower processing temperatures compared to solder pastes. This enables bonding of temperature sensitive components to temperature sensitive substrates without damaging them. Author: Cindy Doumen Read More
Henkel PSA Academy Certified training course for the handling and application of Pressure Sensitive Adhesives (PSAs) Read More
Thermal Interface Materials - Novel Solutions for Power Electronics and Heat Management in Handheld Devices As power electronic devices become more and more prevalent in different markets, the need for new materials to enable higher performance — while maintaining reliability — is gaining higher focus. The management of heat for these upcoming applications requires new designs and technologies. Author: Giuseppe Caramella Read More
Henkel Webinars - Aerospace and Rail Transportation Expert Talks The Expert Talks webinar series offers in-depth discussions with experts on diverse topics. Read More
Printed Electronics ThINK Together Events Welcome to the Henkel Printed Electronics ThINK Together Event Page – A showcase for our digital events, offering first-hand insights on latest material innovations for stretchable, flexible & high-speed printable electronics, material processing advice to improve your screen printability recommendations for innovative material solutions to create seamlessly connected sensing applications within the field of healthcare, hygiene and consumer surfaces Grab a coffee and listen into our latest video podcasts. Read More
Flexible Packaging Converters’ Academy – North America & Mexico Special educational program covering coating solutions, lamination technologies and the practical applications for your unique production Read More