LOCTITE® ABLESTIK 550
Features and Benefits
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This translucent, thermally conductive adhesive film is designed for gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages.
LOCTITE® ABLESTIK 550 is a translucent, thermally conductive adhesive film specially designed for bonding gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages. It gives off methanol, water and ammonia during cure. Not recommended for use in hermetically sealed packages.
- Thermally conductive
- Heat cure
- For difficult-to-bond surfaces
- For sealing microelectronic packages
- Not recommended for use in hermetically sealed packages
Documents and Downloads
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Technical Information
| Cure schedule, @ 150.0 °C | 30.0 min. |
| Cure type | Heat cure |
| Dielectric constant, @ 1kHz | 4.8 |
| Glass transition temperature (Tg) | 105.0 °C |
| Physical form | Film |
| Shear strength, Aluminum | 5700.0 psi |
| Thermal conductivity | 0.2 W/mK |
LOCTITE® ABLESTIK 550
This translucent, thermally conductive adhesive film is designed for gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages.