LOCTITE® ABLESTIK 550
Tuntud kui Ablestik ABLEFILM 550
Omadused ja eelised
slide 1 of 1
This translucent, thermally conductive adhesive film is designed for gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages.
LOCTITE® ABLESTIK 550 is a translucent, thermally conductive adhesive film specially designed for bonding gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages. It gives off methanol, water and ammonia during cure. Not recommended for use in hermetically sealed packages.
Lugege rohkem
Dokumendid ja allalaadimised
Otsite TDS-i või SDS-i teises keeles?
Tehniline teave
| Dielektriline konstant, @ 1kHz | 4.8 |
| Füüsiline vorm | Kile |
| Klaasistumistemperatuur (Tg) | 105.0 °C |
| Kõvenemisaeg, @ 150.0 °C | 30.0 minut |
| Nihkejõud, Alumiinium | 5700.0 psi |
| Soojusjuhtivus | 0.2 W/mK |
| Tahkumistüüp | Kuumkõvenemine |
LOCTITE® ABLESTIK 550
This translucent, thermally conductive adhesive film is designed for gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages.