LOCTITE® ABLESTIK 550
Bekannt als Ablestik ABLEFILM 550
Merkmale und Vorteile
slide 1 of 1
This translucent, thermally conductive adhesive film is designed for gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages.
LOCTITE® ABLESTIK 550 is a translucent, thermally conductive adhesive film specially designed for bonding gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages. It gives off methanol, water and ammonia during cure. Not recommended for use in hermetically sealed packages.
Weiterlesen
Dokumente und Downloads
Suchen Sie nach einem TDS oder SDS in einer anderen Sprache?
Technische Informationen
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 150.0 °C | 30.0 Min. |
| Dielektrizitätskonstante, @ 1kHz | 4.8 |
| Glasübergangstemperatur (Tg) | 105.0 °C |
| Physikalische Form | Film |
| Scherfestigkeit, Aluminium | 5700.0 psi |
| Wärmeleitfähigkeit | 0.2 W/mK |
LOCTITE® ABLESTIK 550
This translucent, thermally conductive adhesive film is designed for gold / gold-plated and difficult-to-bond surfaces, and for sealing microelectronic packages.