Low Pressure Molding Solutions Many electronic assemblies are exposed to extreme conditions, such as strong temperature swings, corrosive environmental media or high humidity. Nevertheless, these devices have to deliver the expected performance, despite difficult environmental conditions. While Henkel has various solutions in its portfolio for electronic component and assembly protection, one in particular is a special hotmelt used in the low pressure molding process. These innovative hotmelts, which Henkel markets under the TECHNOMELT® brand, have a broad range of uses and are now available for almost every application. With the low pressure molding process, it is possible not only to bond surfaces but also to provide protective encapsulation, even for small and delicate electronic components. Thanks to the use of renewable raw materials, hotmelts are more environmentally compatible than other products and are RoHS and WEEE-approved materials. Once the hotmelts are in direct contact ... Read More
Henkel Dual Cure Adhesives Enables Camera Module Success The camera module industry is the focus of much attention, as the addition of camera features into mobile devices — and now into the automotive segment — is driving manufacturers to develop camera technologies that capitalize on this sector’s growth. The more advanced the camera modules become, particularly as pixels and lens quantity increase, a different technique called ‘Active Alignment’ is employed, which requires dual-cure adhesives with UV and thermal cure capabilities to bond the lens holder to the substrate. Read More
Webinar: Henkel Develops Advanced Solder Paste Test Vehicle Webinar discussing Henkel's new test vehicle, and how it addresses miniaturization realities. Read More
Integrated Advanced Underfill Solutions Over the past decade, we have seen a significant growth in the mobile computing market which has propelled the adoption of various interconnection solutions. As further transistor scaling becomes challenging and costly, companies are turning to advanced packaging technologies in order to continue boosting performance and functionality per market demands. Mobile technology will remain to be a key driver in the electronics industry. The trend towards smaller form factors, higher I/O count for increased density and performance, and lower cost of ownership will push alternative solutions requiring innovative materials enabling next- generation packages. In this webinar, we will cover Henkel’s broad range of underfill solutions including Capillary Underfill (CUF), Non Conductive Paste (NCP), and Non Conductive Film (NCF). These materials were developed to support current and future flip- chip interconnect technology across different market segments. Fine pitch Cu Pillar... Read More
Thermal Interface Materials - Novel Solutions for Power Electronics and Heat Management in Handheld Devices As power electronic devices become more and more prevalent in different markets, the need for new materials to enable higher performance — while maintaining reliability — is gaining higher focus. The management of heat for these upcoming applications requires new designs and technologies. Author: Giuseppe Caramella Read More
Henkel to Debut New Materials, Share Expertise at IPC APEX Expo 2018 High-visibility masking material, low-voiding and jetting solder pastes on display. Read More
Henkel Develops Advanced Solder Paste Test Vehicle Novel test vehicle addresses miniaturization realities. Read More