BERGQUIST® BOND PLY TBP 1400LMS-HD

Features and Benefits

This highly durable, thermally conductive material is ideal for securing power components and PCBs to a heat sink. Eliminates mechanical fasteners.
BERGQUIST® BOND PLY TBP 1400LMS-HD is a highly durable laminate material which is heat-curable and eliminates the need for mechanical fasteners. The high performance, flexible silicone design provides exceptional thermal range and effectively absorbs vibrations and other mechanical stresses caused by the assembly process.
  • Thermal performance: 2.3°C (36°F)/W, initial pressure only lamination
  • 200 psi adhesion strength
  • Eliminates the need for mechanical fasteners
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Technical Information

Carrier type Glass Fibre
Colour Yellow
Flame rating V-0
Operating temperature -60.0 - 180.0 °C
Storage temperature 5.0 - 25.0 °C
Thermal conductivity 1.4 W/mK