BERGQUIST® HI FLOW THF 1000F-AC
Known as Hi-Flow® 225F-AC
Features and Benefits
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BERGQUIST HI FLOW THF 1000F-AC, Reinforced, Phase Change Thermal Interface Material
BERGQUIST® HI FLOW® THF 1000F-AC is a high performance, thermal interface material for use between a computer processor and a heat sink. BERGQUIST HI FLOW THF 1000F-AC consists of a soft, thermally conductive 55°C phase change compound coated to the top surface of an aluminum carrier with a soft, thermally conductive adhesive compound coated to the bottom surface to improve adhesion to the heat sink.Above the 55°C phase change temperature, BERGQUIST HI FLOW THF 1000F-AC wets-out the thermal interface surfaces and flows to produce low thermal impedance. BERGQUIST HI FLOW THF 1000F-AC requires pressure from the assembly to cause material flow. The HI-FLOW coatings resist dripping in vertical orientation.The material includes a base carrier liner with differential release properties to facilitate simplicity in roll form packaging and application assembly. Please contact BERGQUIST Product Management for applications that are less than 0.07'' square.
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Technical Information
Carrier film thickness | 0.38 mm |
Color | Black |
Flame rating | V-0 |
Operating temperature | 120.0 °C |
Phase change temperature | 55.0 °C |
Standard thickness | 0.102 mm |
Thermal conductivity | 1.0 W/mK |