LOCTITE® ABLESTIK ABL 2100A

Features and Benefits

LOCTITE ABLESTIK ABL 2100A, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK ABL 2100A die attach adhesive is designed for Pb-free array packaging. This product is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 65.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 200.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 60.0 °C
Thermal conductivity 1.2 W/mK
Thixotropic index 5.3
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9000.0 mPa·s (cP)