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The BOND-PLY family of materials are thermally conductive and electrically isolating. BOND-PLY is available in a PSA or laminating format. BOND-PLY provides for the decoupling of bonded materials with mismatched thermal coefficients of expansion. BOND-PLY provides:

• A replacement to heat cure adhesives
• A replacement to screw mounting
• A replacement to clip mounting

When there is a requirement for bonding large areas or complex parts together, thermal adhesive films are the preferred materials. Larger bonding areas are problematic for liquid-based mediums as voids may result; films, however, deliver uniform, void-free bondlines and controlled thicknesses. Supplied in custom, pre-cut formats, Henkel’s line of thermal adhesive films offers a clean, waste-free, easily-processed solution with a low total, cost of ownership in thermally and electrically-conductive formulas.

Henkel’s liquid adhesives provide robust mechanical attachment, allowing for the elimination of fasteners such as screws and clips, which also helps reduce device size and weight to align with the trend toward electronics miniaturization. These form-in-place elastomers are ideal for coupling “hot” electronic components mounted on PC boards with an adjacent metal case or heat sink. With the ability to maintain thin bondlines and excellent thermal paths, LOCTITE and BERGQUIST brand liquid adhesives provide superb thermal management.

Typical applications include bonding transformers, transistors and other heat-generating electronic components to printed circuit board assemblies or heat sinks. With the ability to maintain thin bondlines and excellent thermal paths, LOCTITE and BERGQUIST brand liquid adhesives provide superb thermal management.