LOCTITE® ABLESTIK CF 3350
특징 및 이점
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
If you need reliable RF ground plane performance, try LOCTITE® ABLESTIK CF 3350. This silver-filled flexible film adhesive has high electrical and thermal conductivity, as well as uniform bondline adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks.
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문서 및 다운로드
다른 언어로 작성된 TDS 또는 SDS를 찾고 계신가요?
기술 정보
| 경화 방식 | 열경화 |
| 경화 시간, @ 150.0 °C | 30.0 분 |
| 물리적 형태 | 필름 |
| 열전도율 | 7.0 W/mK |
LOCTITE® ABLESTIK CF 3350
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.