LOCTITE® ABLESTIK CF 3350
Merkmale und Vorteile
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
If you need reliable RF ground plane performance, try LOCTITE® ABLESTIK CF 3350. This silver-filled flexible film adhesive has high electrical and thermal conductivity, as well as uniform bondline adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks.
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Technische Informationen
| Aushärtetechnik | Aushärtung durch Wärme |
| Aushärtezyklus, @ 150.0 °C | 30.0 Min. |
| Physikalische Form | Film |
| Wärmeleitfähigkeit | 7.0 W/mK |
LOCTITE® ABLESTIK CF 3350
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.