LOCTITE® ABLESTIK CF 3350
功能與優點
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.
If you need reliable RF ground plane performance, try LOCTITE® ABLESTIK CF 3350. This silver-filled flexible film adhesive has high electrical and thermal conductivity, as well as uniform bondline adhesion. It is clean and easy to apply, passes NASA outgassing requirements, and is available in custom preforms. Perfect for circuit board materials, metal backplanes, and heat sinks.
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技術資訊
| 固化類型 | 熱固化 |
| 導熱性 | 7.0 W/mK |
| 建議固化方式, @ 150.0 °C | 30.0 分 |
| 物理形態 | 薄膜 |
LOCTITE® ABLESTIK CF 3350
This silver-filled flexible adhesive film offers high electrical and thermal conductivity, and uniform bondline adhesion. Ideal for circuit board materials, metal backplanes, and heat sinks.