Advanced Semiconductor Packaging
Henkel Solutions for Advanced Semiconductor Packaging
Across market sectors, semiconductor technology is the foundation for delivering what industries and consumers want: robust function, smaller size, unfailing reliability and lower cost. Whether it’s edge and cloud computing, automotive electronics, smart home systems or mobile devices, advances in semiconductor packaging are delivering on these objectives.
As the demands on semiconductor devices intensify year over year, advanced packaging techniques are providing the form factor and processing power required for today’s digitized world. System level integration, higher functionality, faster performance, and relentless miniaturization characterize the electronics market. Achieving these ambitions requires not only design creativity, but material ingenuity. Henkel has set the benchmark for advanced packaging materials development with continued product innovations in underfills, encapsulants, lid and stiffener attach adhesives and package-level EMI solutions for applications including flip chip, wafer-level packaging and memory 3D TSV.
